JPH0331091Y2 - - Google Patents

Info

Publication number
JPH0331091Y2
JPH0331091Y2 JP1984058746U JP5874684U JPH0331091Y2 JP H0331091 Y2 JPH0331091 Y2 JP H0331091Y2 JP 1984058746 U JP1984058746 U JP 1984058746U JP 5874684 U JP5874684 U JP 5874684U JP H0331091 Y2 JPH0331091 Y2 JP H0331091Y2
Authority
JP
Japan
Prior art keywords
electrical component
insulating substrate
thermal expansion
coefficient
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984058746U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60172367U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5874684U priority Critical patent/JPS60172367U/ja
Publication of JPS60172367U publication Critical patent/JPS60172367U/ja
Application granted granted Critical
Publication of JPH0331091Y2 publication Critical patent/JPH0331091Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP5874684U 1984-04-20 1984-04-20 電気部品の取付け構造 Granted JPS60172367U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5874684U JPS60172367U (ja) 1984-04-20 1984-04-20 電気部品の取付け構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5874684U JPS60172367U (ja) 1984-04-20 1984-04-20 電気部品の取付け構造

Publications (2)

Publication Number Publication Date
JPS60172367U JPS60172367U (ja) 1985-11-15
JPH0331091Y2 true JPH0331091Y2 (en]) 1991-07-01

Family

ID=30584540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5874684U Granted JPS60172367U (ja) 1984-04-20 1984-04-20 電気部品の取付け構造

Country Status (1)

Country Link
JP (1) JPS60172367U (en])

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52161256U (en]) * 1976-05-28 1977-12-07
JPS54107858U (en]) * 1978-01-17 1979-07-30

Also Published As

Publication number Publication date
JPS60172367U (ja) 1985-11-15

Similar Documents

Publication Publication Date Title
KR860000188B1 (ko) 혼성집적회로 부품 및 그 부착 방법
JPH06216487A (ja) フレキシブルパターンの接続端子部
JP2000151060A (ja) 電子部品の実装構造
JPH0331091Y2 (en])
JPH0613177U (ja) チップ部品搭載配線基板
JPH06112621A (ja) モジュールのスタンドオフ構造
JPH05327249A (ja) 電子回路モジュール及びその製造方法
US5444299A (en) Electronic package with lead wire connections
JPH0445253Y2 (en])
JPH0536300Y2 (en])
JP2535032Y2 (ja) サーマルプリントヘッド
JP2503911B2 (ja) プリント配線板
JPH11163510A (ja) 電子部品の実装構造
JP3012948U (ja) Ｂｇａ電子部品
JPH06152114A (ja) 電気回路配線基板及びその製造方法並びに電気回路装置
JPS6153852B2 (en])
JPH0639483Y2 (ja) 混成集積回路
JPH0711484Y2 (ja) チップ部品の接続固定装置
JP2883435B2 (ja) 金属コア基板
JPH1154882A (ja) 電子部品搭載用基板
JPH0615269U (ja) 混成集積回路装置用リードアレイ
JPH0590984U (ja) 印刷回路基板
JPH04180211A (ja) コンデンサ
JPH06164096A (ja) 回路基板
JPS63269550A (ja) 半導体装置